Embedded die packaging technology is a technology in which the die is directly embedded into printed circuit board laminated substrate. This technology is widely used in manufacturing and it provides several benefits such as size reduction, power saving, and improving the overall system efficiency on a large scale. The advantages of this technology comprise improved electrical and thermal performance, miniaturization, heterogeneous integration, reduction in cost, and efficient logistics for OEM. In addition, it provides flexible system integration, high robustness, fast turnaround for custom design, and enhanced reliability of the package.
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Global Embedded Die Packaging Technology Market – Company Profiles
- Advanced Semiconductor Engineering, Inc.
- Amkor Technology, Inc.
- Fujikura Ltd.
- Infineon Technologies AG
- Microsemi (Microchip Technology Inc.)
- SCHWEIZER ELECTRONIC AG
- SHINKO ELECTRIC INDUSTRIES CO.,LTD.
- Taiwan Semiconductor Manufacturing Company Ltd.
- TDK Corporation
The embedded die packaging technology market is anticipated to grow owing to the factors such as the increase in number of portable electronic devices, imminent need for circuit miniaturization in microelectronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. Further, the rapid adoption of IoT globally is expected to provide opportunities for embedded die packaging technology market to grow. However, the requirement of high cost of these chips restraints for the growth of the market.
Embedded Die Packaging Technology Market report provides an in-depth insight of Industry covering all important parameters including development trends, challenges, opportunities, key manufacturers and competitive analysis. The research report focuses on the leading competitors of the Embedded Die Packaging Technology Market and provides information such as the company overview, product portfolio, key developments, price, cost, value, volume, revenue, capacity, production, and contact information.
The “Global Embedded die packaging technology Market Analysis to 2027” is a specialized and in-depth study of the Embedded die packaging technology industry with a special focus on the global market trend analysis. The report aims to provide an overview of embedded die packaging technology market with detailed market segmentation by platform, application, industry vertical, and geography. The global embedded die packaging technology market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading embedded die packaging technology market players and offers key trends and opportunities in the market.
The report also provides the market size and estimates a forecast from the year 2019 to 2027 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America providing an exhaustive PEST analysis for all five regions after evaluating political, economic, social and technological factors affecting the Embedded Die Packaging Technology Market.
GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET SEGMENTATION
Global Embedded Die Packaging Technology Market – By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
Global Embedded Die Packaging Technology Market – By Application
- Sports/Fitness Devices
- Medical Implants and Wearable Devices
- Industrial Sensing
- Security Technologies
Global Embedded Die Packaging Technology Market – By Industry Vertical
- Consumer Electronics
- IT & Telecommunication
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